FPC & R-FPC & HDI & HLC
——
IC sealling borad
Vehicle-mounted camera
COB R-FPC
MIC R-FPC
Wireless charging
Industrial control & medical instruments R-FPC
FPC of Fingerprint)
IC card
MiniLED
HDI
HLC
Others

Product Picture

Product Parameter

Mass Run

Sample


IC封装载板.png

Material

FR-4

FR-4

Max. Layer count24
Min Board Thickness

0.1mm

0.1mm

Hole Copper Thickness

12-25μm

12-25μm

Min. Hole sizeLaser:100μmLaser:80μm
Mechanical:0.15mmMechanical:0.1mm
Min. Conductor Width/Spacing50/50μm50/50μm
Aspect ratio

≤4:1

≤6:1

Max. set size

200*300mm

250*400mm

Finished surface

ENIG、ENEPIG

Special Technology

POFV

Product Picture

Product Parameter

R-Mass Run

R-FPC Sample

车载摄像头.png

Material

PI/PI+FR4

PI/PI+FR4

Max. Layer count68
Board Thickness0.4-2.5mm0.3-3.0mm
Hole Copper Thickness.

18-25μm

18-25μm

Min. Hole sizeLaser:100μmLaser:80μm
MC:0.15mmMC:0.15mm
Min. Conductor Width/Spacing75/75μm50/50μm
Aspect ratio

≤8:1

≤10:1

Max. set size

120*250mm

120*250mm

Finished surface

ENIG

Special Technology

POFV

Product Picture

COB Product Parameter

Mass Run

Sample

图片1.png

Material

FR4+PI(PP+PI)

FR4+PI(PP+PI)

Max. Layer count

4-6

6

Board Thickness

0.3-0.5mm

0.3-0.5mm

Copper Thickness.

15-35um

15-35um

Min. Hole size

laser:75μm

laser:75μm

MC:0.1mm

MC0.1mm
Min. Conductor Width/Spacing50μm/50μm
50μm/50μm
Aspect ratio6:1
8:1
Max. set size120*200
120*200
Finished surfaceENEPIG

Special Technology

ENEPIG, high requirement on bonding pad size and flatness, can achieve any layer HDI FVSS(free via stacked up structure).

Product Picture

Product Parameter

R-Mass Run

R-FPC Sample

R-FPC (3).png

Material

FR4+PI(PP+PI)

FR4+PI(PP+PI)

Max. Layer count68
Board Thickness0.3-0.5mm0.3-0.5mm
Hole Copper Thickness.

15-35μm

15-35μm

Min. Hole sizeLaser:100μmLaser:80μm
MC:0.1mmMC:0.1mm
Min. Conductor Width/Spacing50/50μm40/50μm
Aspect ratio

≤8:1

≤10:1

Max. set size

120*120mm

120*200mm

Finished surface

ENIG/ENEPIG

Special Technology

ENEPIG, high requirement on bonding pad size and flatness, can achieve any layer HDI&FVSS(free via stacked up structure)

Product Picture

Wireless charging Product Parameter

Mass Run

Sample

     图片2.pngMaterial

PI

PI

Max. Layer count24
Board Thickness0.2mm0.5mm
Hole Copper Thickness.

10-15μm

10-15μm

Min. Hole sizeLaser:100μmLaser:80μm
Mechanical:0.15mmMechanical:0.15mm
Min. Conductor Width/Spacing100/100μm75/75μm
Aspect ratio

1:1

1:1

Max. set size

230*400mm

230*500mm

Finished surface

ENIG+Golden Finger

Special Technology

Double finished   surface (ENIG + heavy gold)

Product Picture

Product Parameter

Mass Run

Sample

 Material

FR4/PI

FR4/PI

Max. Layer count814
Max Board Thickness1.6mm3.0mm
Hole Copper Thickness.

18-25μm

18-25μm

Min. Hole sizeLaser:100μmLaser:80μm
Mechanical:0.15mmMechanical:0.15mm
Min. Conductor Width/Spacing100/100μm75/75μm
Aspect ratio

≤8:1

≤10:1

Max. set size

230*400mm

230*500mm

Finished surface

ENIG, OSP, ENIG+OSP, Golden Finger, ENEPIG

Special Technology

POFV、ELIC,

Product Picture

Product Parameter

R-Mass Run

R-FPC Sample

 Material

PI

PI

Max. Layer count24
Board Thickness0.1mm0.5mm
Hole Copper Thickness.

10-15μm

10-15μm

Min. Hole sizeLaser:100μmLaser:80μm
Mechanical:0.1mmMechanical:0.1mm
Min. Conductor Width/Spacing50/50μm50/50μm
Aspect ratio

1:1

1:1

Max. set size

120*200mm

120*200mm

Finished surface

ENIG

Special Technology

High requirements on flatness, especially on drive IC area; high grounding resistance required.

Product Picture

IC Card Product Parameter

Mass Run

Sample

IC卡.pngMaterial

FR4/PI

FR4/PI

Max. Layer count24
Min Board Thickness0.15mm0.1mm
Max. Surface Copper Thickness.

35μm

70μm

Min. Hole sizeLaser:100μmLaser:80μm
Mechanical:0.15mmMechanical:0.1mm
Min. Conductor Width/Spacing0.1/0.1mm0.075/0.075mm
Aspect ratio

1:1

2:1

Max. set size

230*400mm

230*500mm

Finished surface

ENIG/ENEPIG

Special Technology


Product Picture

Product Parameter

R-Mass Run

R-FPC Sample

         图片3.pngMaterial

FR4/BT

FR4/BT

Max. Layer count48
Min Board Thickness0.2mm0.1mm
Hole Copper Thickness.

12-25μm

12-25μm

Min. Hole sizeLaser:100μmLaser:80μm
Mechanical:0.1mmMechanical:0.1mm
Min. Conductor Width/Spacing0.075/0.075mm0.075/0.075mm
Aspect ratio

4:1

6:1

Max. set size

250*500mm

300*650mm

Finished surface

ENIG/ENEPIG/OSP

Special Technology


Product Picture

Product Parameter

R-Mass Run

R-FPC Sample

 MaterialFR4Resin material
Max. Layer count8L16L
Board Thickness≤3.0mm≤4.0mm
Copper Thickness.15-60μm

15-100μm

Hole copper thickness

12-25um

12-25um

Min. Hole size

Laser hole :Φ0.1mm

Laser hole :Φ0.1mm

Mechanical Hole:Φ0.2mm

Mechanical Hole:Φ0.1mm

Min. ConductorWidth/Spacing

50μm/50μm

40μm/40μm

Aspect ratio≤1:1

≤1:1

Max. set size520mm*600mm520mm*600mm
Finished surface

ENIG、OSP、OSP+ENIG、Immersion Tin、Immersion Ag、

Plating Au/Ni、Golden finger

Special Technology

Counterbore, Backdrill, Step slots,Plated board edge,   

PTH Half-holes, POFV

Product Picture

Product Parameter

R-Mass Run

R-FPC Sample


6层金手指板.png

Material

FR4

FR4

Max. Layer count1016
Board Thickness0.1-3.0mm0.1-4.0mm
Copper Thickness.

12-100μm

12-100μm

Min. hole sizeMechanical:0.1mmMechanical:0.1mm
Min. Conductor Width/Spacing50/50μm40/40μm
Aspect ratio

≤8:1

≤10:1

Max. set size

520*600mm

520*600mm

Finished surface

ENIG、OSP、ENIG+OSP、Immersion Tin、Immersion Ag、

Plating Au/Ni

Special Technology

Counterbore, Backdrill, Step slots, Plated board edge,

PTH Half-holes, VIP

Note book camera
laser drill(control depth) )
ENIG+plating golden finger
Flat surface Packaging Substrate
thin core PCB
PLCC
PLCC
FPC
R-FPC
FPC
BGA  Sealing Substrate
Customer Service
——
Address : Unit AD9 area. Dongsheng industrial Park. Meizhou City.  Guangdong Province. PRC       
Tel        : 0753-2217168                     
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