IC sealling borad Vehicle-mounted camera COB R-FPC MIC R-FPC Wireless charging Industrial control & medical instruments R-FPC FPC of Fingerprint) IC card MiniLED HDI HLC Others |
Product Picture | Product Parameter | Mass Run | Sample |
Material | FR-4 | FR-4 | |
Max. Layer count | 2 | 4 | |
Min Board Thickness | 0.1mm | 0.1mm | |
Hole Copper Thickness | 12-25μm | 12-25μm | |
Min. Hole size | Laser:100μm | Laser:80μm | |
Mechanical:0.15mm | Mechanical:0.1mm | ||
Min. Conductor Width/Spacing | 50/50μm | 50/50μm | |
Aspect ratio | ≤4:1 | ≤6:1 | |
Max. set size | 200*300mm | 250*400mm | |
Finished surface | ENIG、ENEPIG | ||
Special Technology | POFV |
Product Picture | Product Parameter | R-Mass Run | R-FPC Sample |
Material | PI/PI+FR4 | PI/PI+FR4 | |
Max. Layer count | 6 | 8 | |
Board Thickness | 0.4-2.5mm | 0.3-3.0mm | |
Hole Copper Thickness. | 18-25μm | 18-25μm | |
Min. Hole size | Laser:100μm | Laser:80μm | |
MC:0.15mm | MC:0.15mm | ||
Min. Conductor Width/Spacing | 75/75μm | 50/50μm | |
Aspect ratio | ≤8:1 | ≤10:1 | |
Max. set size | 120*250mm | 120*250mm | |
Finished surface | ENIG | ||
Special Technology | POFV |
Product Picture | COB Product Parameter | Mass Run | Sample |
Material | FR4+PI(PP+PI) | FR4+PI(PP+PI) | |
Max. Layer count | 4-6 | 6 | |
Board Thickness | 0.3-0.5mm | 0.3-0.5mm | |
Copper Thickness. | 15-35um | 15-35um | |
Min. Hole size | laser:75μm | laser:75μm | |
MC:0.1mm | MC:0.1mm | ||
Min. Conductor Width/Spacing | 50μm/50μm | 50μm/50μm | |
Aspect ratio | 6:1 | 8:1 | |
Max. set size | 120*200 | 120*200 | |
Finished surface | ENEPIG | ||
Special Technology | ENEPIG, high requirement on bonding pad size and flatness, can achieve any layer HDI FVSS(free via stacked up structure). |
Product Picture | Product Parameter | R-Mass Run | R-FPC Sample |
Material | FR4+PI(PP+PI) | FR4+PI(PP+PI) | |
Max. Layer count | 6 | 8 | |
Board Thickness | 0.3-0.5mm | 0.3-0.5mm | |
Hole Copper Thickness. | 15-35μm | 15-35μm | |
Min. Hole size | Laser:100μm | Laser:80μm | |
MC:0.1mm | MC:0.1mm | ||
Min. Conductor Width/Spacing | 50/50μm | 40/50μm | |
Aspect ratio | ≤8:1 | ≤10:1 | |
Max. set size | 120*120mm | 120*200mm | |
Finished surface | ENIG/ENEPIG | ||
Special Technology | ENEPIG, high requirement on bonding pad size and flatness, can achieve any layer HDI&FVSS(free via stacked up structure) |
Product Picture | Wireless charging Product Parameter | Mass Run | Sample |
Material | PI | PI | |
Max. Layer count | 2 | 4 | |
Board Thickness | 0.2mm | 0.5mm | |
Hole Copper Thickness. | 10-15μm | 10-15μm | |
Min. Hole size | Laser:100μm | Laser:80μm | |
Mechanical:0.15mm | Mechanical:0.15mm | ||
Min. Conductor Width/Spacing | 100/100μm | 75/75μm | |
Aspect ratio | 1:1 | 1:1 | |
Max. set size | 230*400mm | 230*500mm | |
Finished surface | ENIG+Golden Finger | ||
Special Technology | Double finished surface (ENIG + heavy gold) |
Product Picture | Product Parameter | Mass Run | Sample |
Material | FR4/PI | FR4/PI | |
Max. Layer count | 8 | 14 | |
Max Board Thickness | 1.6mm | 3.0mm | |
Hole Copper Thickness. | 18-25μm | 18-25μm | |
Min. Hole size | Laser:100μm | Laser:80μm | |
Mechanical:0.15mm | Mechanical:0.15mm | ||
Min. Conductor Width/Spacing | 100/100μm | 75/75μm | |
Aspect ratio | ≤8:1 | ≤10:1 | |
Max. set size | 230*400mm | 230*500mm | |
Finished surface | ENIG, OSP, ENIG+OSP, Golden Finger, ENEPIG | ||
Special Technology | POFV、ELIC, |
Product Picture | Product Parameter | R-Mass Run | R-FPC Sample |
Material | PI | PI | |
Max. Layer count | 2 | 4 | |
Board Thickness | 0.1mm | 0.5mm | |
Hole Copper Thickness. | 10-15μm | 10-15μm | |
Min. Hole size | Laser:100μm | Laser:80μm | |
Mechanical:0.1mm | Mechanical:0.1mm | ||
Min. Conductor Width/Spacing | 50/50μm | 50/50μm | |
Aspect ratio | 1:1 | 1:1 | |
Max. set size | 120*200mm | 120*200mm | |
Finished surface | ENIG | ||
Special Technology | High requirements on flatness, especially on drive IC area; high grounding resistance required. |
Product Picture | IC Card Product Parameter | Mass Run | Sample |
Material | FR4/PI | FR4/PI | |
Max. Layer count | 2 | 4 | |
Min Board Thickness | 0.15mm | 0.1mm | |
Max. Surface Copper Thickness. | 35μm | 70μm | |
Min. Hole size | Laser:100μm | Laser:80μm | |
Mechanical:0.15mm | Mechanical:0.1mm | ||
Min. Conductor Width/Spacing | 0.1/0.1mm | 0.075/0.075mm | |
Aspect ratio | 1:1 | 2:1 | |
Max. set size | 230*400mm | 230*500mm | |
Finished surface | ENIG/ENEPIG | ||
Special Technology |
Product Picture | Product Parameter | R-Mass Run | R-FPC Sample |
Material | FR4/BT | FR4/BT | |
Max. Layer count | 4 | 8 | |
Min Board Thickness | 0.2mm | 0.1mm | |
Hole Copper Thickness. | 12-25μm | 12-25μm | |
Min. Hole size | Laser:100μm | Laser:80μm | |
Mechanical:0.1mm | Mechanical:0.1mm | ||
Min. Conductor Width/Spacing | 0.075/0.075mm | 0.075/0.075mm | |
Aspect ratio | 4:1 | 6:1 | |
Max. set size | 250*500mm | 300*650mm | |
Finished surface | ENIG/ENEPIG/OSP | ||
Special Technology |
Product Picture | Product Parameter | R-Mass Run | R-FPC Sample |
Material | FR4 | Resin material | |
Max. Layer count | 8L | 16L | |
Board Thickness | ≤3.0mm | ≤4.0mm | |
Copper Thickness. | 15-60μm | 15-100μm | |
Hole copper thickness | 12-25um | 12-25um | |
Min. Hole size | Laser hole :Φ0.1mm | Laser hole :Φ0.1mm | |
Mechanical Hole:Φ0.2mm | Mechanical Hole:Φ0.1mm | ||
Min. ConductorWidth/Spacing | 50μm/50μm | 40μm/40μm | |
Aspect ratio | ≤1:1 | ≤1:1 | |
Max. set size | 520mm*600mm | 520mm*600mm | |
Finished surface | ENIG、OSP、OSP+ENIG、Immersion Tin、Immersion Ag、 Plating Au/Ni、Golden finger | ||
Special Technology | Counterbore, Backdrill, Step slots,Plated board edge, PTH Half-holes, POFV |
Product Picture | Product Parameter | R-Mass Run | R-FPC Sample |
| Material | FR4 | FR4 |
Max. Layer count | 10 | 16 | |
Board Thickness | 0.1-3.0mm | 0.1-4.0mm | |
Copper Thickness. | 12-100μm | 12-100μm | |
Min. hole size | Mechanical:0.1mm | Mechanical:0.1mm | |
Min. Conductor Width/Spacing | 50/50μm | 40/40μm | |
Aspect ratio | ≤8:1 | ≤10:1 | |
Max. set size | 520*600mm | 520*600mm | |
Finished surface | ENIG、OSP、ENIG+OSP、Immersion Tin、Immersion Ag、 Plating Au/Ni | ||
Special Technology | Counterbore, Backdrill, Step slots, Plated board edge, PTH Half-holes, VIP |
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