Process Capability Manufacture Facility Inspecting Apparatus |
Product Parameter | FPC Mass Run | FPC Sample | R-FPC Mass Run | R-FPC Sample |
| Material | FR-4/PI | FR-4/PI | FR-4/PI | FR-4/PI |
| Max. Layer count | 6 | 8 | 8 | 14 |
| Board Thickness | 0.06-0.4mm | 0.06-0.5mm | 0.4-2.5mm | 0.3-3.0mm |
| Copper Thickness. | ≤50μm | ≤70μm | ≤70μm | ≤70μm |
| Min. Hole size | Laser：100μm | Laser：80μm | Laser：100μm | Laser：80μm |
| Mechanical：0.15mm | Mechanical：0.1mm | Mechanical：0.15mm | Mechanical：0.15mm | |
| Min. Conductor Width/Spacing | 50/50μm | 40/40μm | 50/50μm | 50/50μm |
| Aspect ratio | ≤3:1 | ≤5:1 | ≤8:1 | ≤10:1 |
| Max. set size | 230*300mm | 230*350mm | 230*385mm | 230*400mm |
| Finished surface | ENIG/ENEPIG/OSP | ENIG/ENEPIG/OSP/HASL | ||
Special Technology | ENIG+ENEPIG/ divide layer | POFV、ENIG+ENEPIG | ||
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